Course C-Advanced Semiconductor Manufacturing and Packaging Testing (3 credits)

Appropriate level: senior undergraduate and fresh graduate students of science and engineering background
Language: Taught in English
Number of Participants: 30 students, domestic and overseas
Format: In-person

Completion: NCKU transcript and Certificate

Jointly offered by the Program on Semiconductor Manufacturing Technology, the Program on Semiconductor Packaging and Testing, and NARLabs Taiwan Semiconductor Research Institute (TSRI)

Prof. Wen-Dung Hsu

Ph.D. of Materials Science and Engineering, University of Florida, Gainesville, USA

Dept. Department of Materials Science and Engineering & Program on Key Materials, NCKU

Area: molecular dynamics simulation/Monte Carlo simulation/first principle simulation/coarse-graining molecular dynamics simulation/nano-materials/carbon based materials/transition metal clusters/nano-tribology/nano-mechanics.

Prof. Wei-Chen Tu

PhD, Electronics Engineering, National Taiwan University

Dept. Electrical Engineering & Program on Semiconductor Manufacturing Technology, NCKU

Area: Low dimensional materials and devices/Optical and electrical simulation of nanomaterials and nanodevices/Photodetectors/ Solar cells/Nanoscience and nanotechnology/Applications of quantum dots

Prof. Ying-Yuan Huang

PhD, Electrical and Computer Engineering, Georgia Institute of Technology

Dept. Electrical Engineering and Institute of Microelectronics &Program on Semiconductor Manufacturing Technology, NCKU

Area: Microelectronics, Electrical Engineering

Semiconductor Fabrication

Semiconductor Fabrication delves into the heart of the microelectronics industry, focusing on the manufacturing process of semiconductor devices. This course offers students an essential understanding of the steps involved in the fabrication of semiconductors, including material preparation, chemical/physical vapor deposition, photolithography, etching, and ion implantation. Students will gain insight into the sophisticated processes and innovations that enable the production of ever-smaller and more powerful semiconductor devices.

Prof. Jui-Nung Liu

PhD, Electrical and Computer Engineering, University of Illinois at Urbana-Champaign

Dept. Electrical Engineering and Institute of Microelectronics &Program on Semiconductor Manufacturing Technology, NCKU

Area: Mid-infrared group-IV photonics/Optical nanocavity/ Surface-enhanced vibrational spectroscopy/Cavity QED

Semiconductor-based nanophotonics and their applications

The short course provides an introduction to nanophotonics based on semiconductors and their device applications. Types of optical resonators, including photonic crystals, antennas, and bound states in the continuum will be introduced. Applications of nanophotonic resonators to nanospectroscopy and cavity quantum electrodynamics (CQED) will also be discussed.

Mr. Albert Lan

Over 30 years of job experience in semiconductor industry, esp. advanced packaging technologies.
Senior Engineering Center Director, 14 years, SPIL
PD, Quality, & Sales, 6 years, Amkor Taiwan

Global Sr. Packaging Account TD Head, Applied Materials, USA

Area: Advanced 3D Heterogeneous Integration Packaging Technology Development

Worldwide Innovative 3DHI Packaging Technology Trend

Worldwide Innovative 3DHI Packaging Technology Trend
Innovative 3DHI Packaging Technology Development Applied in AI/HPC – C2W/ W2W Hybrid Bonding
Innovative 3DHI Packaging Technology Development Applied in AI/ HPC – FO-PLP and Advanced Substrate

Dr. Li-Hsuan (Leo) Shen

Ph.D. Civil Engineering, National Taiwan University

Senior Manager of R&D and IC Packaging Product Manager, Moldex3D (CoreTech System Co., Ltd.)

Area: Computational fluid dynamics, Numerical simulation, Structural analysis for IC packaging applications

Applications of Numerical Simulation in the IC Packaging Industry

This course provides an in-depth exploration of the challenges faced in IC packaging, focusing on innovative solutions by applying mechanical theory, material science, and numerical simulation. Participants will gain a conceptual understanding of how these disciplines interact to address and overcome industry-specific difficulties.

Dr. Nikki Chang

Ph. D. Physics, National Taiwan University
MBA, National Taiwan University

Senior Sale Manager, TSMC Account, Applied Materials Taiwan

Area: Digital Lithography Tool Development for Advanced Packaging industry/Photography process optimization/Defect review inspection product development

Photolithography and Patterning

Basic lithography technology
Advance lithography technology
Q&A

Dr. Samuel Chiu

PhD, Materials Science and Engineering, University of California, Los Angeles (UCLA)

Senior Technical Director, Applied Materials Taiwan

Area: Semiconductor fabrication flow and integration/ Plasma and thermal applications in semiconductor process technology/ Materials and Failure Analysis tools and applications/ Quality Assurance and Supplier Chain Engineering/ Large Scale product and project management.

Latest Innovations and Challenges of Semiconductor Technology for 3nm Node and Beyond

Moore’s Law described in 1965 will celebrate its 60th anniversary in 2025. It successfully predicted the economical benefits by continuous semiconductor scaling. We observed its amazing achievements in the past that had dramatically changed the way we lived. The recent explosive growth of Artificial Intelligence (AI), Machine Learning and AR/VR (Artificial Reality, Virtual Reality) require even more advanced semiconductor technology. Taiwan plays a critical role as hub of semiconductor R&D and manufacturing powerhouse to fulfill the needs.
In this presentation, the latest innovation of semiconductor process to drive the success of advanced technology nodes will be described, including FinFET, lithography, and advanced films/etch integration.
Furthermore, the future challenges and opportunities beyond 3nm nodes to keep Moore’s Law alive, such as Gate-All-Around (GAA) structure, backside power rails, and chiplet heterogeneous integration will also be presented.

Mr. Goran Liu

Master, Mechanical Engineering, National Cheng Kong University

Senior Technical Manager, Moldex3D (CoreTech System Co., Ltd.)

Area: Injection Molding Analysis/IC Packaging Stress Simulation/Warpage Simulation/IC Packaging Process Defect/Countermeasures

IC Packaging Computer-Assisted Analysis Operation Course

This course starts with the IC package 2D design drawing to construct a 3D mesh, sets the package material parameters and process conditions, and then performs filling, curing, and warpage analysis.
The analysis results are used to illustrate common defects in packaging and to propose design change and improvement directions.

Dr. Ming-Tao Lee

Ph.D, Department of Materials Science and Engineering, National Chiao Tung University

Associate Researcher, National Applied Research Laboratories Taiwan Semiconductor Research Institute

Area: Resistive Random Access Memory, Semiconductor BEOL process, Gas sensor, ISFET pH sensor

Dr. Pei-ling Li

PhD, Aeronautics and Astronautics, NCKU

Associate Research Fellow, Taiwan Semiconductor Research Institute

Area: Electronic packaging, Semiconductor Processing

Mr. Yuming Yeh

PhD candidate, Institute of Microelectronics Engineering, NCKU

Assistant Researcher, Taiwan Semiconductor Research Institute

Area: Semiconductor Manufacturing Technology, Packaging technology

Mr. WU TUNG-CHING

Master, Chemistry, National Chung Hsing University

Assistant Engineer, Taiwan Semiconductor Research Institute

Area: Advanced Heterogeneous Integration process / Dry Etch process of thin film

※The above information is subject to change.