Course C-Advanced Semiconductor Manufacturing and Packaging Testing (3 credits)
Appropriate level: senior undergraduate and fresh graduate students of science and engineering background
Language: Taught in English
Number of Participants: 30 students, domestic and overseas
Format: In-person
Completion: NCKU transcript and Certificate
Jointly offered by the Program on Semiconductor Manufacturing Technology, the Program on Semiconductor Packaging and Testing, and NARLabs Taiwan Semiconductor Research Institute (TSRI)
Prof. Wen-Dung Hsu
Ph.D. of Materials Science and Engineering, University of Florida, Gainesville, USA
Dept. Department of Materials Science and Engineering & Program on Key Materials, NCKU
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Area: molecular dynamics simulation/Monte Carlo simulation/first principle simulation/coarse-graining molecular dynamics simulation/nano-materials/carbon based materials/transition metal clusters/nano-tribology/nano-mechanics.
Prof. Wei-Chen Tu
PhD, Electronics Engineering, National Taiwan University
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Dept. Electrical Engineering & Program on Semiconductor Manufacturing Technology, NCKU
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Area: Low dimensional materials and devices/Optical and electrical simulation of nanomaterials and nanodevices/Photodetectors/ Solar cells/Nanoscience and nanotechnology/Applications of quantum dots
Prof. Ying-Yuan Huang
PhD, Electrical and Computer Engineering, Georgia Institute of Technology
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Dept. Electrical Engineering and Institute of Microelectronics &Program on Semiconductor Manufacturing Technology, NCKU
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Area: Microelectronics, Electrical Engineering
Semiconductor Fabrication
Semiconductor Fabrication delves into the heart of the microelectronics industry, focusing on the manufacturing process of semiconductor devices. This course offers students an essential understanding of the steps involved in the fabrication of semiconductors, including material preparation, chemical/physical vapor deposition, photolithography, etching, and ion implantation. Students will gain insight into the sophisticated processes and innovations that enable the production of ever-smaller and more powerful semiconductor devices.
Prof. Jui-Nung Liu
PhD, Electrical and Computer Engineering, University of Illinois at Urbana-Champaign
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Dept. Electrical Engineering and Institute of Microelectronics &Program on Semiconductor Manufacturing Technology, NCKU
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Area: Mid-infrared group-IV photonics/Optical nanocavity/ Surface-enhanced vibrational spectroscopy/Cavity QED
Semiconductor-based nanophotonics and their applications
The short course provides an introduction to nanophotonics based on semiconductors and their device applications. Types of optical resonators, including photonic crystals, antennas, and bound states in the continuum will be introduced. Applications of nanophotonic resonators to nanospectroscopy and cavity quantum electrodynamics (CQED) will also be discussed.
Mr. Albert Lan
Over 30 years of job experience in semiconductor industry, esp. advanced packaging technologies.
Senior Engineering Center Director, 14 years, SPIL
PD, Quality, & Sales, 6 years, Amkor Taiwan
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Global Sr. Packaging Account TD Head, Applied Materials, USA
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Area: Advanced 3D Heterogeneous Integration Packaging Technology Development
Worldwide Innovative 3DHI Packaging Technology Trend
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Worldwide Innovative 3DHI Packaging Technology Trend
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Innovative 3DHI Packaging Technology Development Applied in AI/HPC – C2W/ W2W Hybrid Bonding
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Innovative 3DHI Packaging Technology Development Applied in AI/ HPC – FO-PLP and Advanced Substrate
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Dr. Li-Hsuan (Leo) Shen
Ph.D. Civil Engineering, National Taiwan University
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Senior Manager of R&D and IC Packaging Product Manager, Moldex3D (CoreTech System Co., Ltd.)
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Area: Computational fluid dynamics, Numerical simulation, Structural analysis for IC packaging applications
Applications of Numerical Simulation in the IC Packaging Industry
This course provides an in-depth exploration of the challenges faced in IC packaging, focusing on innovative solutions by applying mechanical theory, material science, and numerical simulation. Participants will gain a conceptual understanding of how these disciplines interact to address and overcome industry-specific difficulties.
Dr. Nikki Chang
Ph. D. Physics, National Taiwan University
MBA, National Taiwan University
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Senior Sale Manager, TSMC Account, Applied Materials Taiwan
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Area: DLG & PDC
Photolithography and Patterning
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Basic lithography technology
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Advance lithography technology
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Q&A
Dr. Samuel Chiu
PhD, Materials Science and Engineering, University of California, Los Angeles (UCLA)
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Senior Technical Director, Applied Materials Taiwan
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Area: Semiconductor fabrication flow and integration/ Plasma and thermal applications in semiconductor process technology/ Materials and Failure Analysis tools and applications/ Quality Assurance and Supplier Chain Engineering/ Large Scale product and project management.
Latest Innovations and Challenges of Semiconductor Technology for 3nm Node and Beyond
Moore’s Law described in 1965 will celebrate its 60th anniversary in 2025. It successfully predicted the economical benefits by continuous semiconductor scaling. We observed its amazing achievements in the past that had dramatically changed the way we lived. The recent explosive growth of Artificial Intelligence (AI), Machine Learning and AR/VR (Artificial Reality, Virtual Reality) require even more advanced semiconductor technology. Taiwan plays a critical role as hub of semiconductor R&D and manufacturing powerhouse to fulfill the needs.
In this presentation, the latest innovation of semiconductor process to drive the success of advanced technology nodes will be described, including FinFET, lithography, and advanced films/etch integration.
Furthermore, the future challenges and opportunities beyond 3nm nodes to keep Moore’s Law alive, such as Gate-All-Around (GAA) structure, backside power rails, and chiplet heterogeneous integration will also be presented.
Mr. Goran Liu
Master, Mechanical Engineering, National Cheng Kong University
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Senior Technical Manager, Moldex3D (CoreTech System Co., Ltd.)​
Area: Injection Molding Analysis/IC Packaging Stress Simulation/Warpage Simulation/IC Packaging Process Defect/Countermeasures
IC Packaging Computer-Assisted Analysis Operation Course
This course starts with the IC package 2D design drawing to construct a 3D mesh, sets the package material parameters and process conditions, and then performs filling, curing, and warpage analysis.
The analysis results are used to illustrate common defects in packaging and to propose design change and improvement directions.
Dr. Ming-Tao Lee
Ph.D, Department of Materials Science and Engineering, National Chiao Tung University
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Associate Researcher, National Applied Research Laboratories Taiwan Semiconductor Research Institute
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Area: Resistive Random Access Memory, Semiconductor BEOL process, Gas sensor, ISFET pH sensor
Dr. Pei-ling Li
PhD, Aeronautics and Astronautics, NCKU
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Associate Research Fellow, Taiwan Semiconductor Research Institute
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Area: Electronic packaging, Semiconductor Processing
Mr. Yuming Yeh
PhD candidate, Institute of Microelectronics Engineering, NCKU
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Assistant Researcher, Taiwan Semiconductor Research Institute
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Area: Semiconductor Manufacturing Technology, Packaging technology
Mr. WU TUNG-CHING
Master, Chemistry, National Chung Hsing University
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Assistant Engineer, Taiwan Semiconductor Research Institute
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Area: Advanced Heterogeneous Integration process / Dry Etch process of thin film
※The above information is subject to change.